Equipment

E-Beam and Optical Lithography

1. Electron Beam Lithography

2. Mask Aligner

Thin Film Deposition

1. HV Evaporator

2. UHV Evaporator

3. Atomic Layer Deposition (ALD)

4. Sputter Deposition

Wet and Dry Etching

1. ICP-RIE etcher (F)

2. ICP-RIE etcher (Cl)

3. Vapor HF

4. Plasma Asher

5. HF Wet bench

6. Acid/Base Wet bench

7. Solvent Wet bench

Inspection and characterization

1. Optical microscopes

2. Profilometer

3. DC probe station

4. Ellipsometer

5. Raman

Microscopy and nanomanipulation

1. FEI-SEM

2. Plasma Xe FIB

3. Atomic Force Microscope

Back–End Processing

1. Wire bonder

2. Die Bonder

3. RTA Oven

4. Dicing saw

5. 3D Printer

6. Quartz Tube Furnace